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   * Current project
     1. Installation and Operation of the Joint Plasma Research Facility
     2. Development of Neutral Beam Sources and Applications
     3. Atmospheric Pressure Plasma Application Technology for Industry
     4. Development of metal coating technique on plastic substrate for indoor service pipe
     5. Hydrogen Production by Nuclear Fusion Spin-Off Technology
     6. Constuction of Plasma Properties DB

 

    

Advantageous characteristics of the neutral beam processes of semiconductor
    abrications
   No charge particle (electrons, ions) damages during etching and thin film deposition
  processes
   Room temperature processes are allowable without heating substrates
   High flexibility of choosing substrates: glasses, plastics, and metal thin films
 
    

Neutral beam applications
   Semiconductor etching, lithography, thin film deposition
   Compound semiconductor fabrication (II-VI, III-V, IV-IV elements) ¢¡ solar cells, displays,
  diode lasers, OLEDs (Organic Light Emitting Diodes), mobile devices
   Carbon based materal fabrication ¢¡ CNTs (Carbon Nano-Tubes), DLC (Diamond-like
  carbons) film, Diamond thin films
   Biotechnology ¢¡ Protein fragmentation for mass analysis